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Thermal Module

High-Performance Thermal Solutions for Precision Cooling

EVAC 1U heat sink designed for high-performance cooling in compact rackmount systems, featuring an aluminum extrusion structure with optimized fin design for efficient heat dissipation.

EVAC 1U Thermal Solution

EVAC 2U heat sink designed for high-performance cooling in compact rackmount systems, featuring an aluminum extrusion structure with optimized fin design for efficient heat dissipation.

EVAC 2U Thermal Solution

Customized thermal module with heat pipes and fin structure for high-speed industrial 3D printer robotic arm, enabling efficient heat dissipation and stable, high-precision operation.

Heat Pipe Thermal Solution

Fin-type aluminum heat sink featuring push pin fasteners and thermal interface pad for easy installation on PCBs or IC chips.

Heat Sink for Mezz Power

Fin-type aluminum heat sink featuring push pin fasteners and thermal interface pad for easy installation on PCBs or IC chips.

Heat Sink with Push Pin

This solution is designed for high-performance network data switches with advanced digital functionality and high-speed data transmission. Utilizing air cooling combined with heat exchange principles, the system integrates high-static-pressure, high-airflow, and low-vibration fan motors.

Intelligent Cooling Module

Applied to virtual reality (VR) processing chips on server motherboards, this thermal solution is manufactured from high-conductivity, high-thermal-performance pure copper using precision skiving technology.

VR Heat Sink

High-airflow and high static pressure waterproof fan module with durable dustproof connector for reliable performance in harsh environments.

Waterproof Fan Module

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