About
The EVAC 2U passive composite heat sink for CPUs is a fanless thermal solution engineered to deliver uncompromised performance, reliability, and design flexibility in compact rackmount systems.
Designed for high-performance computer central processing units (CPUs), this thermal solution supports heat dissipation requirements of up to 500W. By integrating multiple heat pipes precisely aligned with designated heat source locations, thermal energy generated by the CPU is rapidly transferred to a large fin array, significantly enhancing overall cooling efficiency.
This design ensures stable operating conditions under sustained high workloads, allowing the CPU to fully realize its computational speed and performance while providing reliable and consistent system operation for demanding computing environments.
Model : 2U EVAC_500W
Size : 364.3*229.75*77.38mm
Material : Aluminum clip-fin, aluminum base, copper heat pipe
Product Application : CPU
