About
Heat Sink for Mezz Power offers customized heat dissipation solutions with high performance and cost efficiency.
This thermal solution is applied to power management ICs on server motherboards. By utilizing high-thermal-conductivity thermal grease and an optimized fin structure with increased contact surface area, heat transfer efficiency is significantly enhanced, allowing the power ICs to operate within safe and stable temperature ranges.
This design greatly improves both performance and service life of the power components, ensuring continuous 24/7 operation of data center servers and supporting mission-critical computing environments with high reliability.
Model : HS-NA4008G2-00
Size : 21*22*20mm
Material : Aluminum
Product Application : Server Motherboard
