VR Heat Sink

Applied to virtual reality (VR) processing chips on server motherboards, this thermal solution is manufactured from high-conductivity, high-thermal-performance pure copper using precision skiving technology.

Designed to handle the high computational loads and intensive thermal demands of VR processing, it delivers efficient and stable heat dissipation, maintaining optimal operating temperatures during sustained operation.

This enables reliable performance for VR rendering and processing workloads, ensuring smooth, immersive virtual reality experiences while supporting continuous operation in high-performance computing and server environments.

Model : 235004

Size : 121.5*7*5mm

Material : Cooper

Product Application : Server Industry