About
The EVAC 1U passive composite heat sink for CPUs is a fanless thermal solution engineered to deliver uncompromised performance, reliability, and design flexibility in compact rackmount systems.
Designed for high-performance computer central processing units (CPUs), this thermal solution supports heat dissipation requirements of up to 360W. By integrating multiple heat pipes precisely aligned with designated heat source locations, thermal energy generated by the CPU is rapidly transferred to a large fin array, significantly enhancing overall cooling efficiency.
This design ensures stable operating conditions under sustained high workloads, allowing the CPU to fully realize its computational speed and performance while providing reliable and consistent system operation for demanding computing environments.
Model : 1U EVAC_360W
Size : 265.3*244*24.65mm
Material : Aluminum clip-fin, aluminum base, copper heat pipe
Product Application : CPU
