High-performance thermal solution featuring heat pipes and copper heatsink modules for server power chips, VR chips, and high-power CPUs (up to 360W), ensuring efficient heat dissipation and stable system operation for data centers and high-computing systems.

Server Industry

▌For Server Power Management Chips

Equipped on server power management chips, utilizing high thermal conductivity thermal paste and enlarged fin contact area through precision grooving. This ensures the chip operates within optimal temperature range, significantly improving performance and lifespan, and maintaining 24/7 continuous operation for data center servers.

▌For Server VR Chips

Applied to VR chips with high computational loads, manufactured with precision-milled pure copper featuring high thermal conductivity and excellent heat dissipation efficiency. This design ensures stable thermal performance under high power and high-resolution processing demands, allowing the VR chip to deliver its full rendering capability and provide a superior immersive virtual reality experience to the end user.

▌For High-Performance Computer CPUs

Multiple heat pipes are strategically positioned to directly contact heat sources and transfer heat to a large surface-area heatsink for rapid dissipation. This maintains an optimal operating environment for the CPU, enabling maximum speed and performance to achieve fast data processing and improved system responsiveness.